Stress analysis by Kossel microdiffraction on a nickel-based single crystal superalloy during an in situ tensile test – Comparison with classical X-Ray diffraction
dc.contributor.author | BOUSCAUD, Denis |
dc.contributor.author | PATOOR, Etienne |
dc.contributor.author
hal.structure.identifier | BERVEILLER, Sophie
|
dc.contributor.author | PESCI, Raphaël |
dc.date.accessioned | 2015 |
dc.date.available | 2015 |
dc.date.issued | 2011 |
dc.date.submitted | 2015 |
dc.identifier.issn | 0255-5476 |
dc.identifier.uri | http://hdl.handle.net/10985/10323 |
dc.description.abstract | A Kossel microdiffraction experimental set up is under development inside a Scanning Electron Microscope (SEM) in order to determine the crystallographic orientation as well as the inter- and intragranular strains and stresses. An area of about one cubic micrometer can be analysed using the microscope probe, which enables to study different kinds of elements such as a grain boundary, a crack, a microelectronic component, etc. The diffraction pattern is recorded by a high resolution Charge-Coupled Device (CCD) camera. The crystallographic orientation, the lattice parameters and the elastic strain tensor of the probed area are deduced from the pattern indexation using a homemade software. The purpose of this paper is to report some results achieved up to now to estimate the reliability of the Kossel microdiffraction technique. |
dc.language.iso | en |
dc.publisher | Trans Tech Publications Inc |
dc.rights | Post-print |
dc.subject | Kossel microdiffraction |
dc.subject | In situ |
dc.subject | Scanning electron microscope |
dc.subject | Synchrotron radiation |
dc.title | Stress analysis by Kossel microdiffraction on a nickel-based single crystal superalloy during an in situ tensile test – Comparison with classical X-Ray diffraction |
dc.identifier.doi | 10.4028/www.scientific.net/MSF.681.1 |
dc.typdoc | Article dans une revue avec comité de lecture |
dc.localisation | Centre de Metz |
dc.subject.hal | Sciences de l'ingénieur: Matériaux |
ensam.audience | Internationale |
ensam.page | 1-6 |
ensam.journal | Materials Science Forum |
ensam.volume | 681 |
hal.identifier | hal-01213841 |
hal.version | 1 |
hal.status | accept |
dc.identifier.eissn | 1662-9760 |