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dc.contributor.authorBAIZEAU, Thomas
dc.contributor.author
 hal.structure.identifier
CAMPOCASSO, Sébastien
12062 VALDUC [DAM/VALDUC]
dc.contributor.author
 hal.structure.identifier
HILD, François
247321 Laboratoire de Mécanique et Technologie [LMT]
dc.contributor.author
 hal.structure.identifier
ROSSI, Frederic
127742 Laboratoire Bourguignon des Matériaux et Procédés [LABOMAP]
dc.contributor.authorPOULACHON, Gerard
dc.date.accessioned2016
dc.date.available2017
dc.date.issued2016
dc.date.submitted2016
dc.identifier.issn0924-0136
dc.identifier.urihttp://hdl.handle.net/10985/11115
dc.description.abstractConventional piezoelectric sensors cannot record the force fluctuations at high frequencies to monitor serrated chip formation. Recently, force measurements by using digital image correlation (DIC) have been reported thanks to imaging devices that become more and more efficient, thereby opening possibilities of high rate acquisition. This study proposes to apply DIC based on closed-form solutions in order to measure cutting forces at camera acquisition frequency. The considered displacement fields are obtained from the Flamant–Boussinesq solution. This method is first applied to picture pairs shot during the cut and then to a full sequence of pictures recorded upon orthogonal cutting of hardened AISI 52100 steel with a c-BN tool. To validate part of the corresponding mechanism, the change of cutting forces is finally investigated when chip segments are formed.
dc.language.isoen
dc.publisherElsevier
dc.rightsPost-print
dc.subjectChip formation
dc.subjectCutting forces
dc.subjectDigital image correlation
dc.subjectAnalytical modeling
dc.titleCutting force sensor based on digital image correlation for segmented chip formation analysis
ensam.embargo.terms2017-07-25
dc.identifier.doi10.1016/j.jmatprotec.2016.07.016
dc.typdocArticle dans une revue avec comité de lecture
dc.localisationCentre de Cluny
dc.subject.halSciences de l'ingénieur: Matériaux
dc.subject.halSciences de l'ingénieur: Mécanique
dc.subject.halSciences de l'ingénieur: Mécanique: Génie mécanique
dc.subject.halSciences de l'ingénieur: Mécanique: Mécanique des matériaux
ensam.audienceInternationale
ensam.page466-473
ensam.journalJournal of Materials Processing Technology
ensam.volume238
ensam.peerReviewingOui
hal.identifierhal-01361336
hal.version1
hal.statusaccept


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