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dc.contributor.author
 hal.structure.identifier
PALIN-LUC, Thierry
26754 Laboratoire Matériaux Endommagement Fiabilité et Ingénierie des Procédés [LAMEFIP]
164351 Institut de Mécanique et d'Ingénierie de Bordeaux [I2M]
dc.contributor.author
 hal.structure.identifier
SELLIER, E.
259761 Université de Bordeaux [UB]
dc.contributor.authorD'ERRICO, F.
dc.contributor.author
 hal.structure.identifier
VANHAEREN, M.
1003 Archéologies et Sciences de l'Antiquité [ArScAn]
dc.date.accessioned2016
dc.date.available2016
dc.date.issued2002
dc.date.submitted2016
dc.identifier.issn0732-8818
dc.identifier.urihttp://hdl.handle.net/10985/11219
dc.description.abstractThe replica technique is often used to study damage evolution at the surface of specimens or industrial components and understand the physicial phenomena responsible for fatigue crack initiation before failure. Replicas are usually made from acetate cellulose film. This paper presents an alternative technique generally used by archaeologists to study lithic use-wear and bone modification. A mold is made from a dental elastomer (silicon based impression material) and a positive replica is made by casting epoxy resin in the mold. Comparative SEM analysis of damaged metallic specimens and their resin replicas show that this technique provides a good resolution and preserves details up to 0.5 micrometer. This easy and low cost method allows a systematic study of micro-crack growth.
dc.language.isoen
dc.publisherSociety for Experimental Mechanics
dc.rightsPost-print
dc.subjectReplica
dc.subjectElastomer
dc.subjectCrack
dc.subjectSEM observation
dc.titleElastomer and resin replicas for sem observation of metallic materials
dc.typdocArticle dans une revue avec comité de lecture
dc.localisationCentre de Bordeaux-Talence
dc.subject.halSciences de l'ingénieur: Matériaux
dc.subject.halSciences de l'ingénieur: Mécanique
dc.subject.halSciences de l'ingénieur: Mécanique: Mécanique des matériaux
ensam.audienceInternationale
ensam.page33-37
ensam.journalExperimental Techniques
ensam.volume26
ensam.issue3
ensam.peerReviewingOui
hal.identifierhal-01372720
hal.version1
hal.statusaccept
dc.identifier.eissn1747-1567


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