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Evidence of 3D strain gradients associated with tin whisker growth

dc.contributor.authorHEKTOR, Johan
dc.contributor.author
 hal.structure.identifier		MARIJON, Jean-Baptiste
86289 Laboratoire Procédés et Ingénierie en Mécanique et Matériaux [PIMM]
dc.contributor.authorRISTINMAA, Matti
dc.contributor.authorHALL, Stephen A.
dc.contributor.authorHALLBERG, Hakan
dc.contributor.authorSRINIVASAN, Iyengar
dc.contributor.author
 hal.structure.identifier		MICHA, Jean-Sébastien
92792 CEA-Direction des Energies (ex-Direction de l'Energie Nucléaire) [CEA-DES (ex-DEN)]
dc.contributor.authorROBACH, Odile
dc.contributor.authorGRENNERAT, Fanny
dc.contributor.author
 hal.structure.identifier		CASTELNAU, Olivier
86289 Laboratoire Procédés et Ingénierie en Mécanique et Matériaux [PIMM]
dc.date.accessioned2018
dc.date.issued2018
dc.date.submitted2018
dc.identifier.issn1359-6462
dc.identifier.urihttp://hdl.handle.net/10985/13301
dc.description.abstractWe have used Differential Aperture X-ray Microscopy (DAXM) to measure grain orientations and deviatoric elastic strains in 3D around a tin whisker. The results show strain gradients through the depth of the tin coating, revealing a higher strain deeper in the Sn layer. These higher strains are explained by the volume change occurring during growth of the intermetallic phase Cu6Sn5 at the interface between the Cu substrate and the Sn coating and at grain boundaries between Sn grains.
dc.language.isoen
dc.publisherElsevier
dc.rightsPost-print
dc.subjectWhiskers
dc.subjectIntermetallic compounds
dc.subjectLead-free solder
dc.subjectX-ray diffraction
dc.titleEvidence of 3D strain gradients associated with tin whisker growth
ensam.embargo.terms2018-11-30
ensam.embargo.lift2018-11-30
dc.identifier.doi10.1016/j.scriptamat.2017.09.030
dc.typdocArticle dans une revue avec comité de lecture
dc.localisationCentre de Paris
dc.subject.halSciences de l'ingénieur: Matériaux
dc.subject.halSciences de l'ingénieur: Mécanique
ensam.audienceInternationale
ensam.page1-4
ensam.journalScripta Materialia
ensam.volume144
ensam.peerReviewingOui
hal.statusunsent


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