Impact of Thermal Aging on the Microstructure Evolution and Mechanical Properties of Lanthanum-Doped Tin-Silver-Copper Lead-Free Solders
dc.contributor.author | SADIQ, Muhammad |
dc.contributor.author | CHERKAOUI, Mohammed |
dc.contributor.author
hal.structure.identifier | PESCI, Raphaël
|
dc.date.accessioned | 2014 |
dc.date.available | 2014 |
dc.date.issued | 2013 |
dc.date.submitted | 2013 |
dc.identifier.issn | 0361-5235 |
dc.identifier.uri | http://hdl.handle.net/10985/7720 |
dc.description | The authors would like to thank Ste´phanie Blanc (Electrical Engineer at Schlumberger) for her useful contribution to the project, Claude Guyomard and Olivier Naegelen (Arts et Me´tiers ParisTech) for the die design and sample casting, respectively, and Jean-Marc Raulot for his enriching discussions. |
dc.description.abstract | An extensive study is made to analyze the impact of pure lanthanum on the microstructure and mechanical properties of Sn-Ag-Cu (SAC) alloys at high temperatures. Different compositions are tested; the temperature applied for the isothermal aging is 150 C, and aging times of 10 h, 25 h, 50 h, 100 h, and 200 h are studied. Optical microscopy with cross-polarized light is used to follow the grain size, which is refined from 8 mm to 1 mm for as-cast samples and is maintained during thermal aging. Intermetallic compounds (IMCs) present inside the bulk Sn matrix affect the mechanical properties of the SAC alloys. Due to high-temperature exposure, these IMCs grow and hence their impact on mechanical properties becomes more significant. This growth is followed by scanning electron microscopy, and energy-dispersive spectroscopy is used for elemental mapping of each phase. A significant refinement in the average size of IMCs of up to 40% is identified for the as-cast samples, and the coarsening rate of these IMCs is slowed by up to 70% with no change in the interparticle spacing. Yield stress and tensile strength are determined through tensile testing at 20 C for as-cast samples and after thermal aging at 150 C for 100 h and 200h. Both yield stress and tensile strength are increased by up to 20% by minute lanthanum doping. |
dc.language.iso | en |
dc.publisher | Institute of Electrical and Electronics Engineers |
dc.rights | Post-print |
dc.subject | Lanthanum |
dc.subject | SAC alloys |
dc.subject | Intermetallic compounds |
dc.subject | Aging temperature |
dc.subject | Aging time |
dc.title | Impact of Thermal Aging on the Microstructure Evolution and Mechanical Properties of Lanthanum-Doped Tin-Silver-Copper Lead-Free Solders |
dc.identifier.doi | 10.1007/s11664-012-2351-8 |
dc.typdoc | Article dans une revue avec comité de lecture |
dc.localisation | Centre de Metz |
dc.subject.hal | Sciences de l'ingénieur: Matériaux |
dc.subject.hal | Sciences de l'ingénieur: Mécanique: Mécanique des matériaux |
ensam.audience | Internationale |
ensam.page | 492-501 |
ensam.journal | Journal of Electronic Materials |
ensam.volume | 42 |
ensam.issue | 3 |
hal.identifier | hal-00934931 |
hal.version | 1 |
hal.status | accept |
dc.identifier.eissn | 1543-186X |