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dc.contributor.author
 hal.structure.identifier
ARDIGO, Maria-Rosa
127742 Laboratoire Bourguignon des Matériaux et Procédés [LABOMAP]
dc.contributor.author
 hal.structure.identifier
AHMED, Maher
127742 Laboratoire Bourguignon des Matériaux et Procédés [LABOMAP]
dc.contributor.author
 hal.structure.identifier
BESNARD, Aurélien
127742 Laboratoire Bourguignon des Matériaux et Procédés [LABOMAP]
dc.date.accessioned2014
dc.date.available2014
dc.date.issued2014
dc.date.submitted2014
dc.identifier.issn1022-6680
dc.identifier.urihttp://hdl.handle.net/10985/8408
dc.description.abstractThin films’ residual stress is often determined by the Stoney formula, using the measurements of the substrate curvature, even if the required hypotheses are not completely respected. In this study, a 2.2 μm titanium nitride coating was deposited by reactive sputtering on a silicon substrate. The Stoney formula was used in order to calculate the residual stress of the film. The radius of curvature was measured, before and after coating by optical profilometer, considering the whole surface of the sample. The effect of the substrate shape (square and rectangular) with various dimensions was investigated. We showed that the shape of the substrate influence strongly the deformation. Moreover, it was highlighted that the choice of the radius (maximum value, minimum value, mean value, with or without initial curvature correction) is critical to the determination of the stress.
dc.language.isoen
dc.publisherTrans Tech Publications
dc.rightsPost-print
dc.subjectThin films
dc.subjectStoney Formula
dc.subjectsubstrate curvature
dc.subjectoptical profilometer
dc.titleStoney formula: Investigation of curvature measurements by optical profilometer
dc.identifier.doi10.4028/www.scientific.net/AMR.996.361
dc.typdocArticle dans une revue avec comité de lecture
dc.localisationCentre de Cluny
dc.subject.halPhysique: matière Condensée: Science des matériaux
dc.subject.halSciences de l'ingénieur: Matériaux
dc.subject.halSciences de l'ingénieur: Mécanique
dc.subject.halSciences de l'ingénieur: Mécanique: Mécanique des matériaux
dc.subject.halSciences de l'ingénieur: Micro et nanotechnologies/Microélectronique
dc.subject.halSciences de l'ingénieur: Traitement du signal et de l'image
ensam.audienceInternationale
ensam.page361-366
ensam.journalAdvanced Materials Research
ensam.volume996
ensam.issueIX
hal.identifierhal-01058720
hal.version1
hal.statusaccept
dc.identifier.eissn1662-8985


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