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dc.contributor.authorGIRAUD, Eliane
dc.contributor.authorPACE, Sergio
dc.contributor.authorLECOMTE-BECKERS, Jacqueline
dc.date.accessioned2014
dc.date.available2014
dc.date.issued2014
dc.date.submitted2014
dc.identifier.urihttp://hdl.handle.net/10985/8605
dc.description.abstractThe aim of this work was to determine the ability to produce thin metallic foils by self-induced ion plating. Foils of pure copper and pure zinc with a thickness of 35 μm have been successfully produced and their characteristics have been compared to foils obtained by conventional techniques (i.e. electroplating and rolling). Results show the following: (i) more or less compact microstructures can be obtained by self-induced ion plating depending on gas pressure and substrate temperature; (ii) microstructures obtained by self-induced ion plating are quite different from those obtained by electroplating and rolling; (iii) Young’s modulus depends on foils roughness; (iv) hardness depends on grain size by exhibiting a Hall-Petch behavior in the case of copper foils and an “inverse” Hall-Petch behavior in the case of zinc foils.
dc.language.isoen
dc.rightsPost-print
dc.subjectMetallic foils,
dc.subjectVacuum deposition
dc.subjectSelf-induced ion plating
dc.subjectNanoindentation tests
dc.titleElaboration of thin foils in copper and zinc by self-induced ion plating
dc.identifier.doi10.5755/j01.ms.20.2.4019
dc.typdocArticle dans une revue avec comité de lecture
dc.localisationCentre de Angers
dc.subject.halSciences de l'ingénieur: Génie des procédés
dc.subject.halSciences de l'ingénieur: Matériaux
ensam.audienceInternationale
ensam.page160-164
ensam.journalMATERIALS SCIENCE (MEDŽIAGOTYRA)
ensam.volume20
ensam.issue2
hal.identifierhal-01068073
hal.version1
hal.statusaccept


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