Elaboration of thin foils in copper and zinc by self-induced ion plating
dc.contributor.author | GIRAUD, Eliane |
dc.contributor.author | PACE, Sergio |
dc.contributor.author | LECOMTE-BECKERS, Jacqueline |
dc.date.accessioned | 2014 |
dc.date.available | 2014 |
dc.date.issued | 2014 |
dc.date.submitted | 2014 |
dc.identifier.uri | http://hdl.handle.net/10985/8605 |
dc.description.abstract | The aim of this work was to determine the ability to produce thin metallic foils by self-induced ion plating. Foils of pure copper and pure zinc with a thickness of 35 μm have been successfully produced and their characteristics have been compared to foils obtained by conventional techniques (i.e. electroplating and rolling). Results show the following: (i) more or less compact microstructures can be obtained by self-induced ion plating depending on gas pressure and substrate temperature; (ii) microstructures obtained by self-induced ion plating are quite different from those obtained by electroplating and rolling; (iii) Young’s modulus depends on foils roughness; (iv) hardness depends on grain size by exhibiting a Hall-Petch behavior in the case of copper foils and an “inverse” Hall-Petch behavior in the case of zinc foils. |
dc.language.iso | en |
dc.rights | Post-print |
dc.subject | Metallic foils, |
dc.subject | Vacuum deposition |
dc.subject | Self-induced ion plating |
dc.subject | Nanoindentation tests |
dc.title | Elaboration of thin foils in copper and zinc by self-induced ion plating |
dc.identifier.doi | 10.5755/j01.ms.20.2.4019 |
dc.typdoc | Article dans une revue avec comité de lecture |
dc.localisation | Centre de Angers |
dc.subject.hal | Sciences de l'ingénieur: Génie des procédés |
dc.subject.hal | Sciences de l'ingénieur: Matériaux |
ensam.audience | Internationale |
ensam.page | 160-164 |
ensam.journal | MATERIALS SCIENCE (MEDŽIAGOTYRA) |
ensam.volume | 20 |
ensam.issue | 2 |
hal.identifier | hal-01068073 |
hal.version | 1 |
hal.status | accept |