https://sam.ensam.eu:443 The DSpace digital repository system captures, stores, indexes, preserves, and distributes digital research material. Sat, 18 Apr 2026 03:58:45 GMT 2026-04-18T03:58:45Z http://hdl.handle.net/10985/26024 Femtosecond laser polishing of pure copper surfaces with perpendicular incidence LOUBÈRE, Emmanuel; KRAIEM, Nada; MAO, Aofei; PREAUD, Sebastien; KUSIAK, Andrzej; VEILLERE, Amelie; SILVAIN, Jean-Francois; LU, Yongfeng Over the past few years, femtosecond (fs) laser processing has drawn a growing interest in a wide range of applications as it offers the possibility to process the surface morphologies of metals and semiconductors. In contrast to other polishing techniques, laser polishing offers a flexible and non-contact solution, thereby avoiding potential external contamination, while enabling a precise selection of processing areas. We investigated the influence of fs laser parameters on surface roughness of pure copper and ablation thickness, focusing on highlighting the importance of fluence and scanning overlap. With a two-step processing strategy, composed of coarse and fine polishing steps, surfaces with Sa < 400 nm were achieved, representing a 98% reduction from the high roughness of 15 μm on initial surfaces. This research demonstrated the possibility of directly polishing rough parts using a fs laser with a perpendicular incidence. © 2025 Wed, 01 Jan 2025 00:00:00 GMT http://hdl.handle.net/10985/26024 2025-01-01T00:00:00Z LOUBÈRE, Emmanuel KRAIEM, Nada MAO, Aofei PREAUD, Sebastien KUSIAK, Andrzej VEILLERE, Amelie SILVAIN, Jean-Francois LU, Yongfeng Over the past few years, femtosecond (fs) laser processing has drawn a growing interest in a wide range of applications as it offers the possibility to process the surface morphologies of metals and semiconductors. In contrast to other polishing techniques, laser polishing offers a flexible and non-contact solution, thereby avoiding potential external contamination, while enabling a precise selection of processing areas. We investigated the influence of fs laser parameters on surface roughness of pure copper and ablation thickness, focusing on highlighting the importance of fluence and scanning overlap. With a two-step processing strategy, composed of coarse and fine polishing steps, surfaces with Sa < 400 nm were achieved, representing a 98% reduction from the high roughness of 15 μm on initial surfaces. This research demonstrated the possibility of directly polishing rough parts using a fs laser with a perpendicular incidence. © 2025