Laboratoire Procédés et Ingénierie en Mécanique et Matériaux (PIMM): Soumissions récentes
Voici les éléments 1198-1204 de 1244
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Article dans une revue avec comité de lecture(Elsevier, 2013)Because of the reverse cyclic plastic zone at the crack tip, there is plastic dissipation in heat at the crack tip under cyclic loading. That creates a heterogeneous temperature field around the crack tip. A thermo-mechanical ...
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Communication avec acte(Congrès français de mécanique (21 ; 2013 ; Bordeaux (Gironde), 2013)This work presents a numerical alternative for the laser drilling simulation problem. Using finite element method is difficult to simulate the hole propagation over time, especially because of moving boundaries due to a ...
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Article dans une revue avec comité de lecture(Elsevier, 2007)The accurate prediction of both the elastic properties and the thermal expansion coefficients is very important for the precise simulation of such processes as injection molding of short-fiber polymer-matrix composites. ...
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Article dans une revue avec comité de lecture(Springer Verlag, 2010)A 3-D transient model based on the numerical resolution of fluid-flow and the heat transfer equations is developped for deep penetration laser welding at high welding speed regime, whic results in the humping phenomenon. ...
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Article dans une revue avec comité de lecture(Elsevier, 2011)In the hybrid laser-arc welding process, a laser beam and an electric arc are coupled in order to combine the advantages of both processes: high welding speed, low thermal load and high depth penetration thanks to the ...
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Article dans une revue avec comité de lecture(Elsevier, 2013)Irganox 1010 stabilized PE was monitored by carbonyl build-up and DSC under oxygen. A scheme for PE stabilization by phenols was implemented and its kinetic parameters were calculated from experimental results. This model ...
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Article dans une revue avec comité de lecture(Wiley, 2012)Multilayered film polycarbonate/polystyrene (PC/PS) comprising 257 layers with total thickness 125 m was made by coextrusion process. The nominal thickness of PC layers was 680 nm, and the nominal thickness of PS layers ...