SAM: Soumissions récentes
Voici les éléments 3739-3745 de 6547
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Communication sans acte(2016)In a few years, Additive Manufacturing (AM) has become a promising technology and opened up new prospects for the product development. Nevertheless, design methods remain predominantly based on conventional manufacturing ...
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Article dans une revue avec comité de lecture(Elsevier, 2018)Nowadays buildings construction is performed by pouring concrete into molds called formworks that are usually prefabricated metallic modules. Defects such as stripping may possibly form during the removal of the formwork ...
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Article dans une revue avec comité de lecture(Elsevier, 2018)Cellular materials such as polymeric foams in particular have been widely studied under uniaxial loading conditions. Many experimental studies have been focusing recently, however, on the responses of these foams to ...
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Article dans une revue avec comité de lecture(Elsevier Masson, 2018)Even if the diffusion equation has been widely used in physics and engineering, and its physical content is well understood, some variants of it escape fully physical understanding. In particular, anormal diffusion appears ...
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Article dans une revue avec comité de lecture(The Society of Naval Architects and Marine Engineers, 2017)While sailing offwind, the trimmer typically adjusts the downwind sail “on the verge of luffing”, occasionally letting the luff of the sail flap. Due to the unsteadiness of the spinnaker itself, maintaining the luff on the ...
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Communication avec acte(J.F. Silva Gomes and Shaker A. Meguid editors, 2017)In this work, the Solid Isotropic Material with Penalization (SIMP) topology optimization (TO) method is revisited and reformulated within the mathematical framework of NURBS functions. This implies several advantages: ...
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Article dans une revue avec comité de lecture(Institute of Electrical and Electronics Engineers, 2016)The modular multilevel converter (MMC) is becoming a promising converter technology for HVDC transmission systems. Contrary to the conventional two- or three-level VSC-HVDC links, no capacitors are connected directly on ...
