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Stress analysis by Kossel microdiffraction on a nickel-based single crystal superalloy during an in situ tensile test – Comparison with classical X-Ray diffraction

Article dans une revue avec comité de lecture
Author
BOUSCAUD, Denis
PATOOR, Etienne
ccBERVEILLER, Sophie
1104 Laboratoire de physique et mécanique des matériaux [LPMM]
178323 Laboratoire d'Etude des Microstructures et de Mécanique des Matériaux [LEM3]
ccPESCI, Raphaël

URI
http://hdl.handle.net/10985/10323
DOI
10.4028/www.scientific.net/MSF.681.1
Date
2011
Journal
Materials Science Forum

Abstract

A Kossel microdiffraction experimental set up is under development inside a Scanning Electron Microscope (SEM) in order to determine the crystallographic orientation as well as the inter- and intragranular strains and stresses. An area of about one cubic micrometer can be analysed using the microscope probe, which enables to study different kinds of elements such as a grain boundary, a crack, a microelectronic component, etc. The diffraction pattern is recorded by a high resolution Charge-Coupled Device (CCD) camera. The crystallographic orientation, the lattice parameters and the elastic strain tensor of the probed area are deduced from the pattern indexation using a homemade software. The purpose of this paper is to report some results achieved up to now to estimate the reliability of the Kossel microdiffraction technique.

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