Institut de Mécanique et d’Ingénierie de Bordeaux (I2M): Recent submissions
Now showing items 78-84 of 795
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Article dans une revue avec comité de lecture(American Physical Society (APS), 2023-12-14)We systematically demonstrate the temperature-dependent thermal transport properties in crystalline Ge2Sb2Te5 via first-principles density functional theory informed linearized Boltzmann transport equation. The investigation, ...
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Article dans une revue avec comité de lecture(Elsevier BV, 2024-01)The analysis of the thermal damages in Notre-Dame de Paris is necessary to estimate the impact of the dramatic 2019 fire on the remaining structure prior to reconstruction. In doing so, the large amount of data being ...
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Article dans une revue avec comité de lecture(AIP Publishing, 2023-04-21)Dedicated coating materials for anechoism and furtivity in underwater acoustics must exhibit a strong reliability regarding their mechanical resistance to hydrostatic pressure. Soft porous materials, especially, a distribution ...
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Article dans une revue avec comité de lecture(Elsevier BV, 2023-11)Materials and structures featuring a combination of high stiffness, strength, and energy absorption are highly demanded. Current studies are focused on the improvement of these mechanical properties without considering ...
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A FEM Free Vibration Analysis of Variable Stiffness Composite Plates through Hierarchical Modeling Article dans une revue avec comité de lecture(MDPI AG, 2023-06-27)Variable Angle Tow (VAT) laminates offer a promising alternative to classical straight-fiber composites in terms of design and performance. However, analyzing these structures can be more complex due to the introduction ...
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Article dans une revue avec comité de lecture(Elsevier BV, 2024-02)The main subject of this study is to investigate the correlations between the evolution of mechanical behavior and the multiscale microstructure of 316 L stainless steel obtained by laser powder bed fusion process (LPBF) ...
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Article dans une revue avec comité de lecture(Elsevier BV, 2024-05)The relentless advancement of electronic devices has led to increased power densities, resulting in thermal challenges that threaten device reliability. This study aims to address this issue through the development ...