SAM: Soumissions récentes
Voici les éléments 3875-3881 de 6547
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Communication sans acte(Elsevier, 2017)In this paper a generic and modular decision support tool developed to solve different planning, assignment or scheduling problems is presented. The utilization of this tool is illustrated by solving a real world multi-period ...
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Article dans une revue avec comité de lecture(IEEE, 2016)In France is estimated a generation of about 17 and 23 kg per year of Waste Electrical and Electronic Equipment (WEEE) per inhabitant, however, in 2014, the return rate for household WEEE hardly reaches 38% of the total ...
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Article dans une revue avec comité de lecture(Elsevier, 2017)Nanostructured and architectured copper niobium composite wires are excellent candidates for the generation of intense pulsed magnetic fields (> 90T) as they combine both high strength and high electrical conductivity. ...
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Article dans une revue avec comité de lecture(Springer Verlag/ASM International, 2017)In the aircraft industry, along with geometrical and dimensional integrity, the surface integrity of manufactured parts is a necessity. In fact, severe anomalies generated during machining may have a substantial impact on ...
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Communication avec acte(The Institute of Life Cycle Assessment, 2016)Life cycle impact of European generic primary and secondary aluminium are well defined. However specific recycling processes are not available in literature. In this study, the environmental assessment of cable recycling ...
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Article dans une revue avec comité de lecture(Wiley, 2017)In the challenging prospect of developing new materials by mixing different polymers to reach a synergetic performance, the present research focuses on the study of the miscibility of two polymers: The acrylonitrile butadiene ...
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Article dans une revue avec comité de lecture(Washington, D.C. : American Chemical Society, 2017)Multilayer coextrusion processing was applied to produce 2049-layer film of poly(butylene succinate-co-butylene adipate) (PBSA) confined against poly(lactic acid) (PLA) using forced assembly, where the PBSA layer thickness ...
