Laboratoire d’Ingénierie des Systèmes Physiques Et Numériques (LISPEN): Recent submissions
Now showing items 463-469 of 699
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Communication avec acte(Gipsa-Lab, 2012)Les systèmes mécatroniques requièrent une forte intégration physique et fonctionnelle. Pour répondre au premier besoin, l’usage d’un outil de modélisation multiphysique tel que le Bond-Graph est nécessaire. Son ...
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Article dans une revue avec comité de lecture(Elsevier, 2015)Facing globalization, territorial competitiveness is considered by (French) public policy makers as promising both economic and social value creation locally. Companies consider territorial specificities when selecting a ...
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Article dans une revue avec comité de lecture(Elsevier, 2015)A design process, whether for a product or for a service, is composed of a large number of activities connected by data and information exchanges. The quality of these exchanges, called in this paper collaboration, requires ...
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Communication avec acte(2013)The objective of this paper is to follow the consequences on the product environmental impact of the industrial strategy through the product development process. Students were observed while designing a bicycle luggage ...
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NUBES : describing, analysing, documenting and sharing digital representations of heritage buildings Communication avec acte(INRIA, 2010)The NUBES project focus on the definition of an informative system on an architectural scale which exploits the relations between the 3D representation of the building (shape, dimensions, state of conservation, hypothetical ...
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Communication avec acte(IEEE, 2013)We report in this work on unprecedented levels of parametric amplification in microelectromechanical systems (MEMS) resonators with integrated piezoelectric actuation and sensing capabilities operated in air. The method ...
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Communication avec acte(Springer, 2012)Virtual assembly platforms (VAPs) provide a means to interrogate product form, fit and function thereby shortening the design cycle time and improving product manufacturability while reducing assembly cost. VAPs lend ...