Elaboration of thin foils in copper and zinc by self-induced ion plating
Article dans une revue avec comité de lecture
Date
2014Journal
MATERIALS SCIENCE (MEDŽIAGOTYRA)Abstract
The aim of this work was to determine the ability to produce thin metallic foils by self-induced ion plating. Foils of pure copper and pure zinc with a thickness of 35 μm have been successfully produced and their characteristics have been compared to foils obtained by conventional techniques (i.e. electroplating and rolling). Results show the following: (i) more or less compact microstructures can be obtained by self-induced ion plating depending on gas pressure and substrate temperature; (ii) microstructures obtained by self-induced ion plating are quite different from those obtained by electroplating and rolling; (iii) Young’s modulus depends on foils roughness; (iv) hardness depends on grain size by exhibiting a Hall-Petch behavior in the case of copper foils and an “inverse” Hall-Petch behavior in the case of zinc foils.
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