Laboratoire d’Ingénierie des Systèmes Physiques Et Numériques (LISPEN): Recent submissions
Now showing items 92-98 of 724
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Communication avec acte(IEEE, 2022-10)The Metaverse's goal is to create a virtual world that incorporates augmented reality, virtual reality, 3D holographic avatars, and other forms of communication. In this paper, a new e-commerce experience was developed to ...
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Communication avec acte(2022)Glancing Angle Deposition (GLAD) is a technique used in Physical Vapor Deposition (PVD) to prepare thin films with specific properties. During the deposition process, a tilt is introduced between the sputtered atoms flux ...
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Article dans une revue avec comité de lecture(2022)In the context of optimization and reduction of cycles of product design in indus-try, digital collaborative tools have a major impact allowing an early-stage integra-tion of multidisciplinary challenges and oftentimes the ...
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Article dans une revue avec comité de lecture(Springer Science and Business Media LLC, 2022-04-13)Identifcation and ftting is an important task in reverse engineering and virtual/augmented reality. Compared to the traditional approaches, carrying out such tasks with a deep learning-based method have much room to ...
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Article dans une revue avec comité de lecture(Taylor & Francis, 2022-11-11)The growth of Information Technologies in industrial contexts have resulted in data proliferation. These data often underlines useful information which can be of great benefit when it comes to decision-making. Key ...
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Communication avec acte(Elsevier BV, 2022-10)Industry 4.0 is leading to rethink how operational decisions are made within companies. In particular, it raises the question of the evolution of employee involvement and autonomy in operational decision-making in a Lean ...
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Article dans une revue avec comité de lecture(SPRINGER, 2022-03-17)Due to its capacity to evolve in a large solution space, the Simulated Annealing (SA) algorithm has shown very promising results for the Reverse Engineering of editable CAD geometries including parametric 2D sketches, ...